| |
Mar 13, 2025
|
|
|
|
|
MT 110 Microelectronics and Solar Cell Manufacturing
Lecture Hours: 3
Credits: 3
Surveys the field of microelectronics. Covers an overview of the technology and manufacturing processes used and the economic and social impacts. Applies to students considering a career in Oregon’s high growth semiconductor and solar cell manufacturing industries. Promotes and supports sustainable and green technologies.
Prerequisite: MTH 070 with a grade of C or better; or consent of instructor.
Student Learning Outcomes:
- Explain common microelectronic and semiconductor industry terms.
- List the various branches of the microelectronics industry.
- Explain the relationship the microelectronics industry has to the rest of the electronics industry.
- State and explain common microelectronics manufacturing processes and the chemistry involved.
- State and explain common solar cell manufacturing processes and the chemistry involved.
- Explain the economic and social impacts brought on by the solar cell manufacturing industry.
- Discuss the future of the microelectronics and solar cell industries and how they will influence society.
- Research and list the microelectronics and solar cell manufacturing companies in the Northwest.
Content Outline
- Microelectronics Terms, Definitions, and Conversions
- Solar Cell Manufacturing Specific Terms and Definitions
- Microelectronics Industry Overview
- Relation of microelectronics to the electronics industry
- Major stages of semiconductor manufacturing
- Growth and impact of semiconductor industry on society
- Solar Cell Industry Overview
- Relation of solar cells to the electronics industry
- Major stages of solar cell manufacturing
- Growth and impact of solar cell industry on society
- Growth and impact of solar cell industry in Oregon
- Materials and Process Chemicals
- Atomic structure
- Molecules, compounds, and mixtures
- States and properties of matter
- Acids, alkalis, and solvents
- Crystal Growth and Wafer Preparation
- Semiconductor materials and preparation
- Crystalline materials
- Crystal orientation and growth
- Wafer preparation
- Similarities and differences of products for microelectronics and solar cell industries
- Contamination Control
- Contamination sources
- Clean room strategies
- Process water, chemicals, and gases
- Clean room maintenance, materials, and supplies
- Overview of Wafer Fabrication
- Wafer terminology
- Basic wafer-fabrication operations
- Construction of semiconductor circuits
- Construction of solar cells
- Chip terminology
- Wafer sort and packaging
- Process Yields
- Process yields overview
- Yield measurement points
- Wafer-sort yield factors
- Assembly and final test yields
- Oxidation
- Silicon dioxide layer uses
- Thermal oxidation mechanism and methods
- Vertical tube furnaces
- Oxidation processes and evaluation
- Photolithography
- Overview of the photomasking process
- Ten-step process
- Photoresist chemistry and performance factors
- Positive and negative resists
- Storage and control of photoresists
- Photomasking processes
- Development
- Inspection
- Etch
- Stripping
- Mask making and the role of IC Mask Designers
- Advanced Photolithographic Processes
- Double masking
- Lift-off, planarization, image reversal, and contrast enhancement
- Antireflective coatings
- Dyed resists
- Pellicles
- Doping
- Formation of a semiconductor junction
- Doping of a region
- Diffusion
- Open and closed-tube diffusion
- Drive-in-oxidation and its effects
- Ion implantation: types, process, equipment, and masks
- Atomic distribution in implanted regions
- Crystal damage
- Annealing
- Channeling
- Evaluation of implanted layers
- Deposition
- Film parameters
- Chemical deposition
- Atmospheric pressure systems
- Low-pressure chemical vapor deposition
- Photochemical
- Deposition films
- Metallization
- Metal film uses and materials
- Deposition methods
- Vacuum pumps
- Wafer Test and Evaluation
- Resistance and resistivity
- Layer thickness measurements
- Junction depth
- Contamination and defect detection
- Critical dimensions measurements
- Electrical measurements
- Pinhole counting
- Manufacturing Technology
- Fabrication and factory economics
- Wafer fabrication costs
- Yields
- Statistical process control
- Equipment used
- Inventory control
- Factory level automation
- Semiconductor Devices and Integrated Circuit Formation
- Semiconductor and integrated-circuit formation
- Superconductors
- Types of semiconductor devices
- Solar cells
- Temperature and acoustic wave devices
- Types of integrated circuits
- Packaging
- Packaging operations
- Prepackaging wafer preparations
- Cleanliness and static control
- Packaging function and design
- Die separation, inspection and attachment
- Bonding
- Sealing techniques
- Lead plating and trimming
- Deflashing and package marking
- Final inspection
- Package process flows
- Safety
- Chemical safety
- Hazmat
- Electrical Safety
- Relation to Sustainable and Green Technologies
|
|